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In the multilayer film, a wiring material, a resist, a resist pattern, a protective film, a hard mask material, an etching stopper, and an interlayer insulating film are generally stacked sequentially. When the multilayer film is formed, the temperature of a vacuum container for supplying a deposition material and the temperature of the wafer in which a multilayer film is formed must be raised to a certain level.
In recent years, a fine processing technique has been used in photolithography. Therefore, it is preferable to use a deposition material having a low vapor pressure. In the case of a deposition material having a low vapor pressure, the amount of the deposition material adsorbed on a heat plate, an adhesion substrate, and a deposition material supplying apparatus increases with the decrease in the vapor pressure of the deposition material. However, when the temperature of the heat plate, the adhesion substrate, and the deposition material supplying apparatus is high, the amount of the deposition material adsorbed on the heat plate, the adhesion substrate, and the deposition material supplying apparatus may decrease.
Therefore, conventionally, during a process in which the temperature of a vacuum container is increased, a dry box in which the temperature is lowered is arranged between the vacuum container and the vacuum container, and the temperature is raised while a wafer in which a multilayer film is formed is transferred to the vacuum container.
Further, in order to smoothly transfer the wafer to the vacuum container, the wafer is received and transferred by a carrier capable of repeatedly receiving and releasing the wafer, and the carrier is mounted on a front surface of the vacuum container.
In order to increase the throughput of the semiconductor manufacturing process, a
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I. Discussion of how one can incorporate into streamflow models the changes that have occurred since the last model due to the implementation of a management tool. II. Discussion of how to adapt an existing model in order to study the long term (i.e. several years or decades) behavior of a stream including the impacts of water management tools.
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3. Given the challenge in incorporating such management tools into models, what implications do those implications for the assessment of stream flow variability and baseline stream flow have?
4. What are ways to incorporate such tools into models at a particular site?